• DocumentCode
    1987634
  • Title

    An accurate compact modelling approach for statistical ageing and reliability

  • Author

    Jie Ding ; Reid, Dave ; Millar, C. ; Asenov, Asen

  • Author_Institution
    Device Modeling Group, Univ. of Glasgow, Glasgow, UK
  • fYear
    2013
  • fDate
    3-5 Sept. 2013
  • Firstpage
    57
  • Lastpage
    60
  • Abstract
    In this paper, we demonstrate a compact modelling approach that allows statistical circuit simulation at arbitrary stages of transistor BTI ageing, using advanced compact model generation techniques implemented in the GSS statistical circuit simulation engine RandomSpice. The methodology links statistical TCAD simulations where different `frozen in time´ stages of BTI degradation are described in terms of average trapped charge density and the corresponding statistical compact models, to statistical circuit level simulations where aging is expressed in terms of time. To accomplish this task we employ an ageing model that links the average threshold voltage shift and the corresponding average trapped charge density to the aging time. We also illustrate how this method can be used to study the evolution of the SRAM static noise margin with transistor ageing.
  • Keywords
    ageing; circuit simulation; semiconductor device models; semiconductor device reliability; statistical analysis; technology CAD (electronics); BTI degradation; GSS statistical circuit simulation engine; RandomSpice; SRAM static noise margin; advanced compact model generation techniques; aging time; average threshold voltage shift; average trapped charge density; compact modelling approach; frozen in time stages; reliability; statistical TCAD simulations; statistical ageing; statistical circuit level simulations; statistical compact models; transistor BTI ageing; Aging; Degradation; Integrated circuit modeling; Random access memory; Semiconductor process modeling; Stress; Transistors; Ageing; Compact model; reliability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2013 International Conference on
  • Conference_Location
    Glasgow
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-4673-5733-3
  • Type

    conf

  • DOI
    10.1109/SISPAD.2013.6650573
  • Filename
    6650573