Impact of intermetallic compound on solder bump electromigration reliability

Solder bumps are important interconnect components for 3D integration. Their mechanical and electrical properties influence the overall reliability of 3D ICs. A characteristic of solder bumps is that during technology processing and usage their material composition changes. This compositional transformation influences the operation of 3D ICs and, in connection with electro-migration, may cause failures in ICs. In this paper we present a model for describing the growth of intermetallic compound inside a solder bump under the influence of electromigration. Simulation results based on the new model are discussed in conjunction with corresponding experimental findings.