DocumentCode :
1987971
Title :
Technology CAD challenges of modeling multi-gate transistors
Author :
Weber, Charles ; Basu, Debdeep ; Kotlyar, Roza ; Morarka, Saurabh
Author_Institution :
Process Technol. Modeling, Intel Corp., Hillsboro, OR, USA
fYear :
2013
fDate :
3-5 Sept. 2013
Firstpage :
117
Lastpage :
118
Abstract :
As the economics of Moores law drives transistor feature scaling, multiple gate devices such as Tri-gate and FinFET transistors have been adopted to control short channel effects. As the device pitch is scaled, traditional strain engineering methods lose effectiveness and parasitics can increase, forcing technologists to evaluate disruptive solutions. Moreover, many local continuum models can no longer accurately describe device behaviour at these scaled dimensions and more advanced models must be adopted to guide process and device development. The challenges of present and future multi-gate device development and the role of technology computer aided design in addressing those challenges are discussed.
Keywords :
MOSFET; semiconductor device models; technology CAD (electronics); FinFET transistors; Moores law; device behaviour; device pitch; local continuum models; multigate device development; multigate transistors; multiple gate devices; process development; scaled dimensions; short channel effects; strain engineering methods; technology CAD challenges; technology computer aided design; transistor feature scaling; tri-gate transistors; Computational modeling; Doping; Logic gates; Predictive models; Silicon; Silicon germanium; Solid modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices (SISPAD), 2013 International Conference on
Conference_Location :
Glasgow
ISSN :
1946-1569
Print_ISBN :
978-1-4673-5733-3
Type :
conf
DOI :
10.1109/SISPAD.2013.6650588
Filename :
6650588
Link To Document :
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