Title :
Direct bonding for true All Quartz Package and new resonator designs
Author :
Vallin, Örjan ; Rangsten, Pelle
Author_Institution :
Angstrom Lab., Uppsala Univ., Sweden
Abstract :
We present the direct bonding method of monocrystalline quartz. Demonstrator devices were designed to show the process compatibility of etching, patterning of electrodes and direct bonding for a true All Quartz Package. The ability to unite different crystallographic directions makes interesting laminates
Keywords :
crystal resonators; laminates; packaging; quartz; wafer bonding; All Quartz Package; SiO2; direct bonding; electrode patterning; etching; laminate; monocrystalline quartz; resonator design; Chemicals; Electrodes; Etching; Hermetic seals; Laminates; Packaging; Silicon on insulator technology; Surface contamination; Temperature; Wafer bonding;
Conference_Titel :
Frequency and Time Forum, 1999 and the IEEE International Frequency Control Symposium, 1999., Proceedings of the 1999 Joint Meeting of the European
Conference_Location :
Besancon
Print_ISBN :
0-7803-5400-1
DOI :
10.1109/FREQ.1999.841427
