DocumentCode
1988081
Title
Unified compact modelling strategies for process and statistical variability in 14-nm node DG FinFETs
Author
Wang, Xiongfei ; Cheng, Binjie ; Brown, A.R. ; Millar, C. ; Alexander, C. ; Reid, Dave ; Kuang, Jente B. ; Nassif, S. ; Asenov, Asen
Author_Institution
Device Modelling Group, Univ. of Glasgow, Glasgow, UK
fYear
2013
fDate
3-5 Sept. 2013
Firstpage
139
Lastpage
142
Abstract
This paper presents a principal component analysis (PCA)-based unified compact modelling strategy for process-induced and statistical variability in 14-nm double gate SOI FinFET technology. There is strong interplay between process and statistical variability in FinFET technology and failure to capture the correlations between them can lead to an inaccurate estimation of overall statistical variability with errors of up to 30%. Therefore a new unified compact modelling strategy for variability, based on comprehensive atomistic simulations within the CD corner space, is presented. First, an extended uniform compact model is built to capture CD process variation using a set of parameters, and then statistical variability is extracted using another small set of `statistical´ parameters. Later, the response of the extracted statistical parameters over the CD space is characterised, and finally used in a PCA method to generate the unified compact models capturing both process and statistical variability over the whole CD variation space.
Keywords
MOSFET; principal component analysis; semiconductor device models; CD corner space; PCA method; comprehensive atomistic simulations; double gate SOI FinFET technology; principal component analysis; process variability; size 14 nm; statistical variability; unified compact modelling strategies; Analytical models; Correlation; FinFETs; Integrated circuit modeling; Logic gates; Metals; Principal component analysis; FinFET; PCA; compact model; interplay; process variability; statistical variability;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices (SISPAD), 2013 International Conference on
Conference_Location
Glasgow
ISSN
1946-1569
Print_ISBN
978-1-4673-5733-3
Type
conf
DOI
10.1109/SISPAD.2013.6650594
Filename
6650594
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