• DocumentCode
    1988081
  • Title

    Unified compact modelling strategies for process and statistical variability in 14-nm node DG FinFETs

  • Author

    Wang, Xiongfei ; Cheng, Binjie ; Brown, A.R. ; Millar, C. ; Alexander, C. ; Reid, Dave ; Kuang, Jente B. ; Nassif, S. ; Asenov, Asen

  • Author_Institution
    Device Modelling Group, Univ. of Glasgow, Glasgow, UK
  • fYear
    2013
  • fDate
    3-5 Sept. 2013
  • Firstpage
    139
  • Lastpage
    142
  • Abstract
    This paper presents a principal component analysis (PCA)-based unified compact modelling strategy for process-induced and statistical variability in 14-nm double gate SOI FinFET technology. There is strong interplay between process and statistical variability in FinFET technology and failure to capture the correlations between them can lead to an inaccurate estimation of overall statistical variability with errors of up to 30%. Therefore a new unified compact modelling strategy for variability, based on comprehensive atomistic simulations within the CD corner space, is presented. First, an extended uniform compact model is built to capture CD process variation using a set of parameters, and then statistical variability is extracted using another small set of `statistical´ parameters. Later, the response of the extracted statistical parameters over the CD space is characterised, and finally used in a PCA method to generate the unified compact models capturing both process and statistical variability over the whole CD variation space.
  • Keywords
    MOSFET; principal component analysis; semiconductor device models; CD corner space; PCA method; comprehensive atomistic simulations; double gate SOI FinFET technology; principal component analysis; process variability; size 14 nm; statistical variability; unified compact modelling strategies; Analytical models; Correlation; FinFETs; Integrated circuit modeling; Logic gates; Metals; Principal component analysis; FinFET; PCA; compact model; interplay; process variability; statistical variability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2013 International Conference on
  • Conference_Location
    Glasgow
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-4673-5733-3
  • Type

    conf

  • DOI
    10.1109/SISPAD.2013.6650594
  • Filename
    6650594