DocumentCode :
1988292
Title :
Density Gradient calibration for 2D quantum confinement: Tri-Gate SOI transistor application
Author :
Pons, N. ; Triozon, Francois ; Jaud, M.-A. ; Coquand, R. ; Martinie, S. ; Rozeau, O. ; Niquet, Yann-Michel ; Nguyen, Viet-Hung ; Oudrhiri, A. Idrissi-El ; Barraud, S.
Author_Institution :
LETI, CEA, Grenoble, France
fYear :
2013
fDate :
3-5 Sept. 2013
Firstpage :
184
Lastpage :
187
Abstract :
This article presents a Density-Gradient (DG) calibration for 2D quantum confinement on Tri-Gate Silicon on insulator cross section for which the top gate interface is <;100>-oriented and the lateral gate interfaces are <;110>-oriented. To calibrate the DG model, we use self-consistent Poisson-Schrödinger calculations and fit the capacitance vs gate voltage (C-V) curves. We first calibrate DG model for one-dimensional quantum confinement (1D) on planar devices cross section for both crystal orientations. Then, we check the validity of the parameters obtained for the two-dimensional (2D) quantum confinement on tri-gate architecture cross-section. The DG model allows a good description of the C-V curves in the case of 2D quantum confinement and the parameters are still valid when we reduce the Tri-Gate cross section up to 4 nm by side.
Keywords :
MOSFET; Poisson equation; Schrodinger equation; calibration; crystal orientation; gradient methods; semiconductor device models; silicon-on-insulator; 1D quantum confinement; 2D quantum confinement; DG model; Poisson-Schrodinger calculations; crystal orientations; density gradient calibration; planar devices cross section; silicon-on-insulator; tri-gate SOI transistor; Calibration; Charge carrier processes; Logic gates; Numerical models; Potential well; Solid modeling; Transistors; Calibration; Density-Gradient; Schrödinger-Poisson; Tri-Gate; crystal orientations;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices (SISPAD), 2013 International Conference on
Conference_Location :
Glasgow
ISSN :
1946-1569
Print_ISBN :
978-1-4673-5733-3
Type :
conf
DOI :
10.1109/SISPAD.2013.6650605
Filename :
6650605
Link To Document :
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