• DocumentCode
    1988324
  • Title

    Quantum confinement point of view for mobility and stress responses on (100) and (110) SingleGate and double-gate nMOSFETs

  • Author

    Wang, Anson C-C ; Chen, Eason ; Tzer-Min Shen ; Wu, Junyong ; Diaz, Carlos H.

  • Author_Institution
    TCAD Div., Taiwan Semicond. Manuf. Co. (TSMC), Hsinchu, Taiwan
  • fYear
    2013
  • fDate
    3-5 Sept. 2013
  • Firstpage
    192
  • Lastpage
    195
  • Abstract
    Impact of quantum confinement on electron mobility and its stress responses for (100) and (110)-orientated single-gate (SG) and double-gate (DG) nMOSFETs is studied. Unstrained electron mobility in (110) DG nMOSFETs is found to be significantly higher than that of (110) SG devices. This paper discusses another physical explanation to the experimentally observed higher electron mobility in (110) FinFET sidewall channels as compared to that observed in planar (110) devices. It is also found that the electron mobility increases faster under uniaxial tensile stress for (110) devices than for (100) ones. The higher mobility in (110) DG devices is attributed to the lighter confinement effective mass of Δ4 valleys and the non-parabolicity of Δ2 valleys along the <;110> directions. With high enough tensile strain, DG nMOSFETs with (110) surface orientation are expected to outperform these on (100).
  • Keywords
    MOSFET; electron mobility; DG devices; FinFET sidewall channels; double-gate nMOSFET; mobility reponse; planar devices; quantum confinement; single-gate nMOSFET; stress response; surface orientation; tensile strain; uniaxial tensile stress; unstrained electron mobility; Electron mobility; FinFETs; Rough surfaces; Silicon; Stress; Surface roughness; mobility; quantum confinement; single-gate and double-gate nMOSFETs; stress response;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2013 International Conference on
  • Conference_Location
    Glasgow
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-4673-5733-3
  • Type

    conf

  • DOI
    10.1109/SISPAD.2013.6650607
  • Filename
    6650607