Title :
A low cost, high performance three-dimensional memory module technology
Author :
Glaser, Alan ; Nakkar, Mouna ; Franzon, Paul ; Rinne, Glenn ; Roberson, Mark ; Rogers, Vince ; Williams, C. Kenneth
Author_Institution :
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Abstract :
We present a new interconnect/chip-attach technology that provides high volumetric efficiency for systems that are not I/O bound, while also providing low weight, good thermal management and low cost. This attach technology, perpendicular chip attach, is well-suited for applications such as memory modules, mixed-signal systems integration, and high-density microelectromechanical systems (MEMS)
Keywords :
integrated circuit interconnections; microassembling; modules; packaging; semiconductor storage; thermal analysis; 3D memory module technology; chip-attach technology; high volumetric efficiency; high-density MEMS; interconnect technology; low cost scheme; microelectromechanical systems; mixed-signal systems integration; perpendicular chip attach; thermal management; Assembly; Bonding; Costs; Memory management; Ovens; Principal component analysis; Stacking; Substrates; Thermal management; Thermal management of electronics;
Conference_Titel :
Memory Technology, Design and Testing, 1997. Proceedings., International Workshop on
Conference_Location :
San Jose, CA
Print_ISBN :
0-8186-8099-7
DOI :
10.1109/MTDT.1997.619387
