A low cost, high performance three-dimensional memory module technology

Author

Glaser, Alan ; Nakkar, Mouna ; Franzon, Paul ; Rinne, Glenn ; Roberson, Mark ; Rogers, Vince ; Williams, C. Kenneth

Author_Institution

Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA

fYear

1997

fDate

11-12 Aug 1997

Firstpage

2

Lastpage

7

Abstract

We present a new interconnect/chip-attach technology that provides high volumetric efficiency for systems that are not I/O bound, while also providing low weight, good thermal management and low cost. This attach technology, perpendicular chip attach, is well-suited for applications such as memory modules, mixed-signal systems integration, and high-density microelectromechanical systems (MEMS)

Keywords

integrated circuit interconnections; microassembling; modules; packaging; semiconductor storage; thermal analysis; 3D memory module technology; chip-attach technology; high volumetric efficiency; high-density MEMS; interconnect technology; low cost scheme; microelectromechanical systems; mixed-signal systems integration; perpendicular chip attach; thermal management; Assembly; Bonding; Costs; Memory management; Ovens; Principal component analysis; Stacking; Substrates; Thermal management; Thermal management of electronics;

fLanguage

English

Publisher

ieee

Conference_Titel

Memory Technology, Design and Testing, 1997. Proceedings., International Workshop on

Conference_Location

San Jose, CA

ISSN

1087-4852

Print_ISBN

0-8186-8099-7

Type

conf

DOI

10.1109/MTDT.1997.619387

Filename

619387