DocumentCode
1988874
Title
Analysis of the latch-up process and current filamentation in high-voltage trench-IGBT cell arrays
Author
Toechterle, C. ; Pfirsch, F. ; Sandow, C. ; Wachutka, G.
Author_Institution
Inst. for Phys. of Electrotechnol., Munich Univ. of Technol., Munich, Germany
fYear
2013
fDate
3-5 Sept. 2013
Firstpage
296
Lastpage
299
Abstract
We present a theoretical analysis of the formation of current filaments leading to the latch-up state that can occur during the turn-off process in a cell array of high-voltage (3.3 kV) trench insulated-gate bipolar transistors (trench IGBTs). Our investigations, based on self-consistent physical device simulations, aim at understanding the behavior of multiple cells, i.e. parallel cells as well as integrated structures, during overcurrent turnoff by studying the behavior of a representative single cell under identical conditions. With these insights we are able to analyse the latch-up mechanism itself as well as its consequences for the robustness of the device against latch-up. Furthermore, we gain an understanding of the formation of current filaments inside IGBT cells and their relation to device latch-up.
Keywords
insulated gate bipolar transistors; power bipolar transistors; semiconductor device models; high-voltage trench insulated-gate bipolar transistors; integrated structures; latch-up state; overcurrent turnoff; representative single cell; self-consistent physical device simulations; turn-off process; voltage 3.3 kV; Analytical models; Crosstalk; Current density; Insulated gate bipolar transistors; Isothermal processes; Load modeling; Numerical models;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices (SISPAD), 2013 International Conference on
Conference_Location
Glasgow
ISSN
1946-1569
Print_ISBN
978-1-4673-5733-3
Type
conf
DOI
10.1109/SISPAD.2013.6650633
Filename
6650633
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