• DocumentCode
    1989025
  • Title

    Grain growth and thermal stability of Ag thin films

  • Author

    Shugurov, A.R. ; Panin, A.V. ; Chun, H.-G. ; Loginov, B.

  • Author_Institution
    Inst. of Strength Phys. & Mater. Sci., SB RAS, Tomsk, Russia
  • fYear
    2005
  • fDate
    26 June-2 July 2005
  • Firstpage
    528
  • Lastpage
    531
  • Abstract
    The processes of grain growth and agglomeration into separate islands in sputtered Ag thin films subjected to thermal treatment are studied by scanning probe microscopy. Using an Arrhenius relation between the grain growth constant and annealing temperature, activation energy (0.40 eV) for the grain growth process is estimated. Close value (0.38 eV) is found for activation energy for the mass transport mechanism governing the film islanding. This indicates that surface diffusion is a key mass transport mechanism controlling plastic deformation of Ag thin films under annealing.
  • Keywords
    annealing; elemental semiconductors; grain growth; scanning probe microscopy; semiconductor thin films; silver; surface diffusion; thermal stability; 0.40 eV; Ag; Arrhenius relation; activation energy; annealing temperature; film islanding; grain growth; mass transport mechanism; plastic deformation; scanning probe microscopy; surface diffusion; thermal stability; thermal treatment; thin films; Annealing; Atomic force microscopy; Conductive films; Plastic films; Sputtering; Substrates; Surface topography; Temperature; Thermal stability; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Science and Technology, 2005. KORUS 2005. Proceedings. The 9th Russian-Korean International Symposium on
  • Print_ISBN
    0-7803-8943-3
  • Type

    conf

  • DOI
    10.1109/KORUS.2005.1507775
  • Filename
    1507775