DocumentCode
1989025
Title
Grain growth and thermal stability of Ag thin films
Author
Shugurov, A.R. ; Panin, A.V. ; Chun, H.-G. ; Loginov, B.
Author_Institution
Inst. of Strength Phys. & Mater. Sci., SB RAS, Tomsk, Russia
fYear
2005
fDate
26 June-2 July 2005
Firstpage
528
Lastpage
531
Abstract
The processes of grain growth and agglomeration into separate islands in sputtered Ag thin films subjected to thermal treatment are studied by scanning probe microscopy. Using an Arrhenius relation between the grain growth constant and annealing temperature, activation energy (0.40 eV) for the grain growth process is estimated. Close value (0.38 eV) is found for activation energy for the mass transport mechanism governing the film islanding. This indicates that surface diffusion is a key mass transport mechanism controlling plastic deformation of Ag thin films under annealing.
Keywords
annealing; elemental semiconductors; grain growth; scanning probe microscopy; semiconductor thin films; silver; surface diffusion; thermal stability; 0.40 eV; Ag; Arrhenius relation; activation energy; annealing temperature; film islanding; grain growth; mass transport mechanism; plastic deformation; scanning probe microscopy; surface diffusion; thermal stability; thermal treatment; thin films; Annealing; Atomic force microscopy; Conductive films; Plastic films; Sputtering; Substrates; Surface topography; Temperature; Thermal stability; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Science and Technology, 2005. KORUS 2005. Proceedings. The 9th Russian-Korean International Symposium on
Print_ISBN
0-7803-8943-3
Type
conf
DOI
10.1109/KORUS.2005.1507775
Filename
1507775
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