• DocumentCode
    1989103
  • Title

    Thickness Dependences of Phase Change and Channel Current Control in Phase-Change Channel Transistor

  • Author

    Yin, Y. ; Miyachi, A. ; Niida, D. ; Sone, H. ; Hosaka, S.

  • Author_Institution
    Satellite Venture Business Laboratory (SVBL), Gunma University, 1-5-1 Tenjin, Kiryu, Gunma, 376-8515, Japan, E-mail: yinyou@el.gunma-u.ac.jp
  • fYear
    2005
  • fDate
    19-21 Dec. 2005
  • Firstpage
    617
  • Lastpage
    620
  • Abstract
    We investigated electrical properties on phase change and channel current control effect in phase-change channel transistors with a 10-nm- to 200-nm-thick Ge2Sb2Te5film channel by Joule heating and annealing. I-V characteristics showing a phase change by Joule heating were measured. The current switching from an amorphous to crystalline state is about 2μA. A channel current control effect by the gate voltage since Joule heating in 50-nm- to 200-nm-thick devices was observed but not strong. Switching to the lowly resistive state in devices with an ultrathin channel was difficult, which might be due to large voids forming in the heated Ge2Sb2Te5channel. After annealing, drain-source resistance of devices dropped by about 3 orders of magnitude owing to phase change. A clear channel current control effect was observed especially for devices with an ultrathin channel. There exists a strong thickness dependence of channel current control effect.
  • Keywords
    Annealing; Crystallization; Current control; Electric current control; Electrodes; Insulation; MOSFETs; Phase change random access memory; Phase measurement; Resistance heating;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices and Solid-State Circuits, 2005 IEEE Conference on
  • Print_ISBN
    0-7803-9339-2
  • Type

    conf

  • DOI
    10.1109/EDSSC.2005.1635349
  • Filename
    1635349