DocumentCode
1989103
Title
Thickness Dependences of Phase Change and Channel Current Control in Phase-Change Channel Transistor
Author
Yin, Y. ; Miyachi, A. ; Niida, D. ; Sone, H. ; Hosaka, S.
Author_Institution
Satellite Venture Business Laboratory (SVBL), Gunma University, 1-5-1 Tenjin, Kiryu, Gunma, 376-8515, Japan, E-mail: yinyou@el.gunma-u.ac.jp
fYear
2005
fDate
19-21 Dec. 2005
Firstpage
617
Lastpage
620
Abstract
We investigated electrical properties on phase change and channel current control effect in phase-change channel transistors with a 10-nm- to 200-nm-thick Ge2 Sb2 Te5 film channel by Joule heating and annealing. I-V characteristics showing a phase change by Joule heating were measured. The current switching from an amorphous to crystalline state is about 2μA. A channel current control effect by the gate voltage since Joule heating in 50-nm- to 200-nm-thick devices was observed but not strong. Switching to the lowly resistive state in devices with an ultrathin channel was difficult, which might be due to large voids forming in the heated Ge2 Sb2 Te5 channel. After annealing, drain-source resistance of devices dropped by about 3 orders of magnitude owing to phase change. A clear channel current control effect was observed especially for devices with an ultrathin channel. There exists a strong thickness dependence of channel current control effect.
Keywords
Annealing; Crystallization; Current control; Electric current control; Electrodes; Insulation; MOSFETs; Phase change random access memory; Phase measurement; Resistance heating;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices and Solid-State Circuits, 2005 IEEE Conference on
Print_ISBN
0-7803-9339-2
Type
conf
DOI
10.1109/EDSSC.2005.1635349
Filename
1635349
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