Title :
2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)
Abstract :
The following topics are dealt with: adhesive joints in microwave applications; electrical conductivity of anisotropic chemical adhesives; conductive adhesive fillets for double sided PCBs; solderable conductive pastes; application of adhesives in MEMS, and MOEMS assembly; isotropically conductive adhesives; reliability; epoxy resins for UV laser cure; double-layer no-flow underfill materials and process; encapsulant characterization tools for process setup and failure analysis; low temperature processable core material for embedded inductor; triazine containing polymers for use in integrated optics; fine pitch flip chip on flex interconnection process; stackable package using chip in polymer technology; high volume printing technologies; lamination technique for electronic packaging; laser processing of flexible substrates; all-polymer field effect transistors and organic thin film transistors; ultra-high dielectric constant polymer based composite; and vacuum molded flip chip packaging technology.
Keywords :
adhesives; composite materials; encapsulation; fine-pitch technology; flip-chip devices; integrated circuits; integrated optics; micro-optics; microassembling; micromechanical devices; optoelectronic devices; packaging; polymers; printing; substrates; MEMS assembly; MOEMS assembly; PCB; adhesive joints; conductive adhesive; encapsulant characterization; epoxy resins; fine pitch technology; flexible substrates; flip chip packaging technology; integrated optics; lamination technique; microelectronics; packaging; photonics; polymer technology; printing technologies; reliability; solderable conductive pastes; transistors; underfill materials; Encapsulation; Flip-chip devices; Integrated circuits; Integrated optics; Microassembly; Microelectromechanical devices; Nonhomogeneous media; Optoelectronic devices; Packaging; Printing;
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2002. POLYTRONIC 2002. 2nd International IEEE Conference on
Conference_Location :
Zalaegerszeg, Hungary
Print_ISBN :
0-7803-7567-X
DOI :
10.1109/POLYTR.2002.1020173
