Title :
Identification and quantification of 4H-SiC (0001)/SiO2 interface defects by combining density functional and device simulations
Author :
Ettisserry, D.P. ; Salemi, S. ; Goldsman, N. ; Potbhare, S. ; Akturk, A. ; Lelis, Aivars
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Maryland, College Park, MD, USA
Abstract :
In this work, we use Density Functional Theory (DFT)-based electronic structure calculations, together with 2D-Device simulations and experiments, to identify and quantify mobility-limiting defects at the 4H-Silicon Carbide (0001) / Silicon Dioxide interface of a Silicon Carbide (SiC) DMOSFET channel. DFT simulations are performed on a variety of possible interfacial defects including the single Carbon interstitial and the Carbon dimer interstitial to calculate their projected Density of States (pDOS) and energy levels. A unique methodology is presented to determine the defect energy levels and corresponding defect concentrations along the channel using DFT calculations, 2D-Device simulations and device I-V measurements. By comparing the results obtained from DFT and 2D-Device simulations, we identified single Carbon interstitials to be the main contributor to mobility-limiting near-interface traps. The defect concentration was also calculated for various locations in the channel.
Keywords :
MOSFET; density functional theory; interstitials; semiconductor device models; silicon compounds; wide band gap semiconductors; 2D-device simulations; DFT simulations; DMOSFET channel; SiC-SiO2; carbon dimer interstitial; defect concentrations; defect energy levels; density functional simulation; density of states; device I-V measurements; electronic structure calculations; interface defects; interfacial defects; mobility-limiting defects; mobility-limiting near-interface traps; single carbon interstitial; Carbon; Discrete Fourier transforms; Energy states; Equations; Mathematical model; Photonic band gap; Silicon carbide; density functional theory; device simulation; near interface trap; silicon carbide;
Conference_Titel :
Simulation of Semiconductor Processes and Devices (SISPAD), 2013 International Conference on
Conference_Location :
Glasgow
Print_ISBN :
978-1-4673-5733-3
DOI :
10.1109/SISPAD.2013.6650658