• DocumentCode
    1989565
  • Title

    Quantum transport simulation of Bilayer pseudoSpin Field-Effect Transistor (BiSFET) with tight-binding hartree-fock model

  • Author

    Xuehao Mou ; Register, Leonard F. ; Banerjee, Sanjay K.

  • Author_Institution
    Microelectron. Res. Center, Univ. of Texas at Austin, Austin, TX, USA
  • fYear
    2013
  • fDate
    3-5 Sept. 2013
  • Firstpage
    420
  • Lastpage
    423
  • Abstract
    A simulation tool for modeling superfluid quantum transport in the proposed Bilayer Psuedo-spin Field Effect Transistor (BiSFET) and related systems is described and demonstrated. An interlayer Fock exchange interaction is incorporated into a π-orbital based atomistic tight-binding model of transport in two graphene layers separated by a tunnel barrier. Simulation results support and extend expectations based on bulk analysis such as superfluid condensate formation, enhanced interlayer tunneling and the sub-thermal voltage (sub-kBT/q) switching. Extension of this method to other quasi-two dimensional material systems should be possible as well.
  • Keywords
    HF calculations; field effect transistors; graphene; semiconductor device models; superfluidity; tight-binding calculations; tunnelling; BiSFET; C; atomistic tight-binding model; bilayer pseudospin field effect transistor; graphene layers; interlayer Fock exchange interaction; interlayer tunneling; quantum transport simulation; subthermal voltage switching; superfluid condensate formation; superfluid quantum transport; tight binding Hartree-Fock model; tunnel barrier; Atomic layer deposition; Couplings; Elementary particle exchange interactions; Graphene; Photonic band gap; Switches; Tunneling; BiSFET; Fock exchange; atomistic tight binding; graphene; quantum transport; superfluid condensate;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2013 International Conference on
  • Conference_Location
    Glasgow
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-4673-5733-3
  • Type

    conf

  • DOI
    10.1109/SISPAD.2013.6650664
  • Filename
    6650664