Title :
Reduced temperature flip-chip technologies on flexible display substrates using adhesives
Author :
Vanfleteren, Jan ; Vandecasteele, Bjorn ; Raevens, Steven ; Maattanen, Jarmo ; Perttula, Pasi
Author_Institution :
Imec/Intec/TFCG, Gent, Belgium
Abstract :
The paper investigates the possibilities to flip-chip assemble Si driver chips onto a flexible display, which is to be integrated in a smart card. The chips are Au or Ni/Au bumped, the substrate material consists of PES (polyether sulphone) with conductive ITO pads. One technology, using ICA and NCA seems to be quite straightforward, another, using ACA, reveals the problem of ITO damage during thermocompression.
Keywords :
adhesives; contact resistance; driver circuits; flip-chip devices; interconnections; smart cards; substrates; surface mount technology; anisotropic conductive adhesives; conductive pads; driver chips; flexible display substrates; isotropic conductive adhesives; mounting process; nonconductive adhesives; passive interconnection test chips; polyether sulphone; reduced temperature flip-chip technologies; smart card; thermocompression; Assembly; Bonding; Conducting materials; Electric variables measurement; Electrical resistance measurement; Gold; Liquid crystal displays; Smart cards; Temperature; Testing;
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2002. POLYTRONIC 2002. 2nd International IEEE Conference on
Print_ISBN :
0-7803-7567-X
DOI :
10.1109/POLYTR.2002.1020189
