Analysis and Characterization of Some Common Transitions and Interconnections using Three-Dimensional Modelling Techniques

This paper will present the analysis and characterization of several different transitions and interconnections which are in common use, but have not to date been investigated by other workers in this field. These were analyzed using a 3-dimensional finite element modelling technique together with characterization in the frequency and time domains and include the coaxial to microstrip transition and several different types of substrate interconnections. The models developed enable the optimum physical geometry to be determined in order to minimize the effects of the discontinuity over a given frequency range.