Title :
The analysis and evaluation of chip scale package (CSP) solder joint reliability
Author :
Yang, HongZhen ; Cao, XinYu
Author_Institution :
Electron. Eng. Dept., North China Inst. of Aerosp. Eng., Langfang, China
Abstract :
Analysis using ANSYS software, CSP component was reduced to two-dimensional model. In the thermal cyclic loading conditions using finite element simulating the stress and strain distribution of CSP components, obtained a dangerous solder joint of structural failure. The number of failure cycles about dangerous solder joint was predicted. Finally, introduced several analysis and evaluation method for the CSP solder joint reliability evaluation.
Keywords :
chip scale packaging; finite element analysis; production engineering computing; reliability; soldering; stress-strain relations; ANSYS software; CSP solder joint reliability; chip scale package; finite element simulation; stress-strain distribution; structural failure; thermal cyclic loading condition; Chip scale packaging; Finite element methods; Reliability; Soldering; Strain; Stress; Temperature distribution; CSP; Chip Scale Package; Finite element analysis; Reliability;
Conference_Titel :
Electrical and Control Engineering (ICECE), 2011 International Conference on
Conference_Location :
Yichang
Print_ISBN :
978-1-4244-8162-0
DOI :
10.1109/ICECENG.2011.6057842
