DocumentCode :
1990066
Title :
Optimized Nickel Suilicide Technology for Fully Depleted Nano-Scale SIO MOSFETs
Author :
Yun, J.G. ; Oh, S.Y. ; Kim, Y.J. ; Lee, W.J. ; Wang, T. ; Tuya, A. ; Ji, H.H. ; Han, I.S. ; Wang, J.S. ; Lee, H.D.
Author_Institution :
Dept. of Electron. Eng., Chungnam Nat. Univ., Daejeon
fYear :
0
fDate :
0-0 0
Firstpage :
765
Lastpage :
768
Abstract :
Optimized nickel silicide technology is proposed for high performance fully depleted nano-scale SOI CMOSFETs. Nickel silicide properties with different initial nickel thicknesses were investigated on thin film SOI MOSFETs. Silicon consumption rate and correlation between the deposited nickel and the formed nickel silicide thickness were calculated. It was shown that more thermally stable nickel silicide was formed with the controlled nickel thickness. Moreover, enhanced device performance of fully depleted SOI NMOSFET was demonstrated with the controlled nickel thickness
Keywords :
MOSFET; nickel compounds; silicon-on-insulator; fully depleted nanoscale SOI MOSFET; optimized nickel silicide technology; silicon consumption rate; Conductivity; MOSFETs; Nickel; Semiconductor films; Shape; Silicidation; Silicides; Silicon; Solids; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices and Solid-State Circuits, 2005 IEEE Conference on
Conference_Location :
Howloon, Hong Kong
Print_ISBN :
0-7803-9339-2
Type :
conf
DOI :
10.1109/EDSSC.2005.1635389
Filename :
1635389
Link To Document :
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