DocumentCode :
1990381
Title :
Reliability study for high temperature stable conductive adhesives
Author :
Tao, Wenkai ; Chen, Si ; Berggren, Par ; Liu, Johan
Author_Institution :
Key State Lab. of New Displays & Syst. Applic., Shanghai Univ., Shanghai, China
fYear :
2010
fDate :
Feb. 28 2010-March 2 2010
Firstpage :
74
Lastpage :
77
Abstract :
With fast development of electronic packaging, the conductive adhesives were widely used in surface mount and chip interconnection. As an alternative to solder, it has many advantages, such as low processing temperature, less environment contamination and fine pitch capability. However, conductive adhesive joining technology also simultaneously faces a lot of challenges. The major problem of current conductive adhesives is easy to degrade during temperature and humidity aging. Therefore a high temperature stable matrix was developed for conductive adhesive fabrication. Based on this matrix, a kind of isotropic conductive adhesive (ICA) was fabricated in this work. The curing behavior of ICA was investigated by Differential Scanning Calorimeter (DSC). The properties such as glass transition temperature (Tg), storage modulus were detected by Dynamic Mechanical Analyzer (DMA). Thermogravimetric Analysis (TGA) was used to determine the decomposition behavior. The humidity test was subsequently carried out to evaluate moisture resistance of ICA. The electrical resistances of the ICA samples were measured by the multimeter. During humidity test, no obvious change of electrical resistance of ICA samples was observed.
Keywords :
conductive adhesives; curing; differential scanning calorimetry; electronics packaging; fine-pitch technology; joining processes; reliability; chip interconnection; curing behavior; decomposition behavior; differential scanning calorimeter; dynamic mechanical analyzer; electrical resistance; electronic packaging; environment contamination; fine pitch capability; glass transition temperature; high temperature stable conductive adhesives; high temperature stable matrix; humidity aging; humidity test; isotropic conductive adhesive; joining technology; low processing temperature; moisture resistance; reliability; storage modulus; surface mount; temperature aging; thermogravimetric analysis; Aging; Conductive adhesives; Degradation; Electric resistance; Electronics packaging; Humidity; Independent component analysis; Surface contamination; Temperature; Testing; contact resistance; humidity; isotropic conductive adhesives;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging Materials: Microtech, 2010. APM '10. International Symposium on
Conference_Location :
Cambridge
Print_ISBN :
978-1-4244-6756-3
Type :
conf
DOI :
10.1109/ISAPM.2010.5441378
Filename :
5441378
Link To Document :
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