Title :
Characterization of electrode material parameters
Author :
Abbott, B. ; Chen, Alan ; Daniel, Tim ; Gamble, Kevin ; Gratier, Julien ; Kook, Taeho ; Naumenko, Natalya
Author_Institution :
TriQuint Semicond., Inc., Apopka, FL, USA
Abstract :
Rigorous SAW device analysis methods, such as FEM/SDA rely upon the accurate characterization of the elastic moduli and mass density for both the piezoelectric substrate as well as the materials comprising the devices´ thin film electrodes. As the values for the moduli and density of thin films may be significantly different than those for bulk materials, and vary with the deposition process, a means to accurately characterize the values for the elastic moduli and mass density for the thin film metallization is needed. To accomplish the goal of characterizing the moduli and mass density for a thin film metallization, an approach has been devised which is sensitive to the longitudinal and shear modulus, the thin film´s mass density, as well as the geometry of the SAW device´s electrodes.
Keywords :
density; electrodes; finite element analysis; piezoelectric thin films; shear modulus; surface acoustic wave devices; FEM; SAW device analysis; elastic moduli; electrode material parameters; finite element analysis; mass density; piezoelectric substrate; shear modulus; thin film electrode; thin film metallization; Electrodes; Inorganic materials; Metallization; Piezoelectric devices; Piezoelectric films; Piezoelectric materials; Sputtering; Substrates; Surface acoustic wave devices; Thin film devices;
Conference_Titel :
Ultrasonics Symposium (IUS), 2009 IEEE International
Conference_Location :
Rome
Print_ISBN :
978-1-4244-4389-5
Electronic_ISBN :
1948-5719
DOI :
10.1109/ULTSYM.2009.5441421