Title :
A 2D Ultrasonic array design incorporating hexagonal-shaped elements and triangular-cut piezocomposite substructure for NDE applications
Author :
Dziewierz, J. ; Ramadas, S.N. ; Gachagan, A. ; Leary, R. L O ; Hayward, G.
Author_Institution :
Centre for Ultrasonic Eng., Univ. of Strathclyde, Glasgow, UK
Abstract :
Contemporary 2D Ultrasonic arrays suffer from low SNR and limited steering capabilities. Yet, there is a great desire in the industry to increase the operational frequency, in order to enhance their volumetric imaging resolution. State-of-the art arrays use an orthogonal matrix of rectangular elements as this is a natural step forward from the conventional 1D array structure. The objective of this work is to evaluate properties of triangular, rather than rectangular ceramic pillars in a 1-3 connectivity piezoelectric composite for application in a hexagonal-element 2D array. A 3MHz prototype device exploiting new hexagonal substructure have been manufactured. Measured mechanical cross-coupling level is -21.9dB between neighbouring hexagonal elements, providing validation of simulation result. Corroboration between measured and FE modelled device behaviour is demonstrated.
Keywords :
composite materials; nondestructive testing; piezoceramics; piezoelectric devices; ultrasonic imaging; ultrasonic transducer arrays; 1D array structure; 2D ultrasonic array design; NDE application; finite element method; frequency 3 MHz; hexagonal-shaped elements; mechanical cross-coupling level; piezoelectric composite; rectangular ceramic pillars; triangular-cut piezocomposite substructure; volumetric imaging resolution; Acoustic arrays; Acoustic measurements; Apertures; Ceramics; Manufacturing; Signal to noise ratio; Ultrasonic imaging; Ultrasonic transducer arrays; Ultrasonic transducers; Ultrasonic variables measurement; 2D arrays; 2D ultrasonic Array; Acoustic imaging; Acoustic transducers; Crosstalk; Flaw detection; Mutual Coupling; active arrays; hexagonal;
Conference_Titel :
Ultrasonics Symposium (IUS), 2009 IEEE International
Conference_Location :
Rome
Print_ISBN :
978-1-4244-4389-5
Electronic_ISBN :
1948-5719
DOI :
10.1109/ULTSYM.2009.5441447