DocumentCode :
1992696
Title :
Reducing the Leakage Current and PDP in the Quasi-Floating Gate Circuits
Author :
Razaghian, Farhad ; Bonakdarpour, Sahar
Author_Institution :
Dept. of Electr. Eng., Islamic Azad Univ., Tehran, Iran
fYear :
2012
fDate :
27-30 May 2012
Firstpage :
1
Lastpage :
4
Abstract :
Recently, by increasing the usage of battery-powered systems such as laptop, mobile, wristwatch and etc. power dissipation is becoming an important constraint in each electronically design. To reduce the power dissipation, it has been offered to use a floating gate MOSFET technology. According to decline the size of the circuits and power dissipation, thickness of the gate oxide will decrease and this causes a big leakage current in the VLSI circuits. So, new methods should be recommended to maintain the charges in the nodes. In this paper we try to present a new Quasi FGMOS technique to solve this problem. Simulations in a 65 nm process show that by using our proposed Quasi FGMOS, there will be lower PDP and also leakage current than conventional Quasi FGMOSs have.
Keywords :
MOSFET; leakage currents; nanoelectronics; floating gate MOSFET technology; gate oxide; leakage current; quasi FGMOS technique; quasi-floating gate circuit; size 65 nm; Integrated circuit modeling; Inverters; Leakage current; Logic gates; Power dissipation; Threshold voltage; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering and Technology (S-CET), 2012 Spring Congress on
Conference_Location :
Xian
Print_ISBN :
978-1-4577-1965-3
Type :
conf
DOI :
10.1109/SCET.2012.6342135
Filename :
6342135
Link To Document :
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