DocumentCode
1992974
Title
Dynamic Simulation of Ecological Footprint in Response to Socio-economic Development: An Approach of Set Pair Analysis Model
Author
Li, Xiangmei ; Zhou, Jingxuan ; Shao, Xiaogang ; Chen, Jian´an
Author_Institution
Sch. of Environ. Sci. & Eng., Huazhong Univ. of Sci. & Technol., Wuhan
Volume
2
fYear
2008
fDate
21-22 Dec. 2008
Firstpage
738
Lastpage
742
Abstract
Dynamic simulation of Ecological footprint (EF) is essential for evaluating human impact on earth as well as for planning for a sustainable future. In the past studies, the built models neglected the indeterminate factors affecting the EF. In this paper, a set pair analysis (SPA) dynamic model was constructed to forecast the total ecological footprint (TEF) from 2005 to 2020. Both TEF and related socio-economic factors of TEF together were dealt with in order to build SPA model and analyzed the development trends of TEF in the following 17 years. Up to 2020, the district would have been bearing accumulative TEF of 28.478 million gha, which is near 2 times than that of 2004. Although the increase rate of gross domestic product (GDP) would be restricted in a lower level during the general planning period (2005-2020), the urban eco-environmental burden could not respond to the socio-economic circumstances promptly. The adaptability of SPA in ecosystem modeling was presented based on the case study.
Keywords
ecology; set theory; socio-economic effects; sustainable development; ecological footprint; ecosystem modeling; gross domestic product; set pair analysis model; socio-economic development; sustainable future planning; urban eco-environmental burden; Analytical models; Biological system modeling; Economic forecasting; Economic indicators; Ecosystems; Educational technology; Humans; Joining processes; Predictive models; Uncertainty;
fLanguage
English
Publisher
ieee
Conference_Titel
Education Technology and Training, 2008. and 2008 International Workshop on Geoscience and Remote Sensing. ETT and GRS 2008. International Workshop on
Conference_Location
Shanghai
Print_ISBN
978-0-7695-3563-0
Type
conf
DOI
10.1109/ETTandGRS.2008.354
Filename
5070468
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