DocumentCode :
1993387
Title :
Estimation of thermal status in multi-core systems
Author :
Corbetta, Simone ; Fornaciari, William
Author_Institution :
Dipt. di Elettron. e Inf., Politec. di Milano, Milan, Italy
fYear :
2011
fDate :
15-18 May 2011
Firstpage :
1660
Lastpage :
1663
Abstract :
Modern multi-core architectures are prone to a complex dynamic thermal management process: the presence of multiple cores adds challenges to the temperature estimation activity, due to the induced heat-up process from adjacent cores. Run-time estimation can benefit from floorplan information to better estimate the thermal characteristics of each core, and transient information can help the system to predict and avoid thermal alarms, increasing the system reliability and lifetime. In this context, the present work aims at defining a novel on-line measurement methodology based on neighbor nodes and transient information, providing a metric to be employed in thermal-aware designs, either at design-time to characterize application and platform from a thermal view-point, or at run-time in conjunction with the Dynamic Thermal Management subsystem. The proposed methodology intercepts floorplan-induced thermal behavior that would be otherwise unrecognized, and it also shows how a non-floorplan-aware methodology can reveal up to a 30% error in the estimate of thermal status.
Keywords :
circuit layout; computer architecture; multiprocessing systems; power aware computing; design-time; dynamic thermal management subsystem; floorplan induced thermal behavior; floorplan information; induced heat-up process; multicore architecture; nonfloorplan-aware methodology; online measurement; run-time estimation; system lifetime; system reliability; temperature estimation; thermal alarm prediction; thermal aware design; thermal status estimation; thermal view-point; Couplings; Estimation; Heating; Mathematical model; Multicore processing; Thermal management; Transient analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems (ISCAS), 2011 IEEE International Symposium on
Conference_Location :
Rio de Janeiro
ISSN :
0271-4302
Print_ISBN :
978-1-4244-9473-6
Electronic_ISBN :
0271-4302
Type :
conf
DOI :
10.1109/ISCAS.2011.5937899
Filename :
5937899
Link To Document :
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