• DocumentCode
    1993387
  • Title

    Estimation of thermal status in multi-core systems

  • Author

    Corbetta, Simone ; Fornaciari, William

  • Author_Institution
    Dipt. di Elettron. e Inf., Politec. di Milano, Milan, Italy
  • fYear
    2011
  • fDate
    15-18 May 2011
  • Firstpage
    1660
  • Lastpage
    1663
  • Abstract
    Modern multi-core architectures are prone to a complex dynamic thermal management process: the presence of multiple cores adds challenges to the temperature estimation activity, due to the induced heat-up process from adjacent cores. Run-time estimation can benefit from floorplan information to better estimate the thermal characteristics of each core, and transient information can help the system to predict and avoid thermal alarms, increasing the system reliability and lifetime. In this context, the present work aims at defining a novel on-line measurement methodology based on neighbor nodes and transient information, providing a metric to be employed in thermal-aware designs, either at design-time to characterize application and platform from a thermal view-point, or at run-time in conjunction with the Dynamic Thermal Management subsystem. The proposed methodology intercepts floorplan-induced thermal behavior that would be otherwise unrecognized, and it also shows how a non-floorplan-aware methodology can reveal up to a 30% error in the estimate of thermal status.
  • Keywords
    circuit layout; computer architecture; multiprocessing systems; power aware computing; design-time; dynamic thermal management subsystem; floorplan induced thermal behavior; floorplan information; induced heat-up process; multicore architecture; nonfloorplan-aware methodology; online measurement; run-time estimation; system lifetime; system reliability; temperature estimation; thermal alarm prediction; thermal aware design; thermal status estimation; thermal view-point; Couplings; Estimation; Heating; Mathematical model; Multicore processing; Thermal management; Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (ISCAS), 2011 IEEE International Symposium on
  • Conference_Location
    Rio de Janeiro
  • ISSN
    0271-4302
  • Print_ISBN
    978-1-4244-9473-6
  • Electronic_ISBN
    0271-4302
  • Type

    conf

  • DOI
    10.1109/ISCAS.2011.5937899
  • Filename
    5937899