• DocumentCode
    1993621
  • Title

    A fully-adjustable dynamic range capacitance sensing circuit in a 0.15µm 3D SOI process

  • Author

    Song, Jianan ; Welch, David ; Christen, Jennifer Blain

  • Author_Institution
    Sch. of Electr., Comput. & Energy Eng., Arizona State Univ., Tempe, AZ, USA
  • fYear
    2011
  • fDate
    15-18 May 2011
  • Firstpage
    1708
  • Lastpage
    1711
  • Abstract
    We describe a fully-adjustable dynamic range capacitance sensor circuit implemented with switched capacitors in a 3D process. The dynamic range and sampling frequency are set by the frequency of two clock inputs that control an on-chip four phase non-overlapping clock generation circuit. The chip also contains a bandgap reference, increasing the accuracy of the capacitance measurements. It also has full temperature control capabilities via the PTAT circuit and resistive heating element. The circuits were fully simulated using the Cadence IC 6 simulation tool. The 3D chips were provided by Lincoln Lab at Massachusetts Institute of Technology (MITLL). MITLL fabricate a 3D wafer by bonding 3 stacked wafers each from the IBM silicon over insulator (SOI) 0.15 μm process.
  • Keywords
    CMOS digital integrated circuits; capacitance measurement; capacitive sensors; circuit simulation; clocks; heating elements; power aware computing; resistance heating; silicon-on-insulator; switched capacitor networks; system-on-chip; temperature control; three-dimensional integrated circuits; wafer bonding; 3D SOI process; 3D chips; 3D wafer fabrication; Cadence IC 6 simulation tool; IBM; PTAT circuit; bandgap reference; capacitance measurements; circuit simulation; clock inputs; fully-adjustable dynamic range capacitance sensing circuit; on-chip four phase nonoverlapping clock generation circuit; resistive heating element; sampling frequency; silicon over insulator; size 0.15 mum; switched capacitors; temperature control capability; wafer bonding; Capacitance; Capacitors; Clocks; Integrated circuit modeling; Temperature measurement; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (ISCAS), 2011 IEEE International Symposium on
  • Conference_Location
    Rio de Janeiro
  • ISSN
    0271-4302
  • Print_ISBN
    978-1-4244-9473-6
  • Electronic_ISBN
    0271-4302
  • Type

    conf

  • DOI
    10.1109/ISCAS.2011.5937911
  • Filename
    5937911