DocumentCode
1993621
Title
A fully-adjustable dynamic range capacitance sensing circuit in a 0.15µm 3D SOI process
Author
Song, Jianan ; Welch, David ; Christen, Jennifer Blain
Author_Institution
Sch. of Electr., Comput. & Energy Eng., Arizona State Univ., Tempe, AZ, USA
fYear
2011
fDate
15-18 May 2011
Firstpage
1708
Lastpage
1711
Abstract
We describe a fully-adjustable dynamic range capacitance sensor circuit implemented with switched capacitors in a 3D process. The dynamic range and sampling frequency are set by the frequency of two clock inputs that control an on-chip four phase non-overlapping clock generation circuit. The chip also contains a bandgap reference, increasing the accuracy of the capacitance measurements. It also has full temperature control capabilities via the PTAT circuit and resistive heating element. The circuits were fully simulated using the Cadence IC 6 simulation tool. The 3D chips were provided by Lincoln Lab at Massachusetts Institute of Technology (MITLL). MITLL fabricate a 3D wafer by bonding 3 stacked wafers each from the IBM silicon over insulator (SOI) 0.15 μm process.
Keywords
CMOS digital integrated circuits; capacitance measurement; capacitive sensors; circuit simulation; clocks; heating elements; power aware computing; resistance heating; silicon-on-insulator; switched capacitor networks; system-on-chip; temperature control; three-dimensional integrated circuits; wafer bonding; 3D SOI process; 3D chips; 3D wafer fabrication; Cadence IC 6 simulation tool; IBM; PTAT circuit; bandgap reference; capacitance measurements; circuit simulation; clock inputs; fully-adjustable dynamic range capacitance sensing circuit; on-chip four phase nonoverlapping clock generation circuit; resistive heating element; sampling frequency; silicon over insulator; size 0.15 mum; switched capacitors; temperature control capability; wafer bonding; Capacitance; Capacitors; Clocks; Integrated circuit modeling; Temperature measurement; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems (ISCAS), 2011 IEEE International Symposium on
Conference_Location
Rio de Janeiro
ISSN
0271-4302
Print_ISBN
978-1-4244-9473-6
Electronic_ISBN
0271-4302
Type
conf
DOI
10.1109/ISCAS.2011.5937911
Filename
5937911
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