Title :
Non-particulate static dissipative polymers used in wafer handling equipment
Author_Institution :
Advanced Micro Devices #1 AMD Place, Sunnyvale, California 94088
Abstract :
With the advance of polymer technology, more and more static safe materials that are free of particulate additives have been used in building the wafer handling equipment. This paper reviews the potential electrostatic problems with the manual and semi-automatic wafer handling process and various solutions using non-sloughing particulate and non-p(articu1ate static dissipative polymers at strategic locations on the equipment and tools.
Keywords :
Additives; Chemicals; Cleaning; Conductivity; Contamination; Electrostatic discharge; Fabrication; Plastic insulation; Polymers; Sparks;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium,1997. Proceedings
Conference_Location :
Orlando, FL, USA
Print_ISBN :
1-878303-69-4
DOI :
10.1109/EOSESD.1997.634225