DocumentCode :
1995081
Title :
Non-particulate static dissipative polymers used in wafer handling equipment
Author :
Tan, Wayne
Author_Institution :
Advanced Micro Devices #1 AMD Place, Sunnyvale, California 94088
fYear :
1997
fDate :
25-25 Sept. 1997
Firstpage :
49
Lastpage :
58
Abstract :
With the advance of polymer technology, more and more static safe materials that are free of particulate additives have been used in building the wafer handling equipment. This paper reviews the potential electrostatic problems with the manual and semi-automatic wafer handling process and various solutions using non-sloughing particulate and non-p(articu1ate static dissipative polymers at strategic locations on the equipment and tools.
Keywords :
Additives; Chemicals; Cleaning; Conductivity; Contamination; Electrostatic discharge; Fabrication; Plastic insulation; Polymers; Sparks;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium,1997. Proceedings
Conference_Location :
Orlando, FL, USA
Print_ISBN :
1-878303-69-4
Type :
conf
DOI :
10.1109/EOSESD.1997.634225
Filename :
634225
Link To Document :
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