DocumentCode :
1995179
Title :
Progress in Microwave High-Power Devices
Author :
Hori, Shigekazu
Author_Institution :
Microwave Solid-state department, Komukai works, Toshita Corporation, 72 Horikawa-cho, Saiwaiku, Kawasaki 210, Japan.
fYear :
1987
fDate :
7-11 Sept. 1987
Firstpage :
102
Lastpage :
109
Abstract :
This paper describes the recent progress of the microwave high-power devices in Japan, especially forcussing on GaAs power FETs. The fabrication process of power GaAs FET chips, and the internally matched power FETs covering from C- to Ka-band are described. New compound semiconductor devices such as InP MISFETs and HEMTs are also forcussed.
Keywords :
Electromagnetic heating; Fabrication; Gallium arsenide; HEMTs; Indium phosphide; MOCVD; MODFETs; Microwave FETs; Microwave devices; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference, 1987. 17th European
Conference_Location :
Rome, Italy
Type :
conf
DOI :
10.1109/EUMA.1987.333702
Filename :
4132329
Link To Document :
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