DocumentCode
1995179
Title
Progress in Microwave High-Power Devices
Author
Hori, Shigekazu
Author_Institution
Microwave Solid-state department, Komukai works, Toshita Corporation, 72 Horikawa-cho, Saiwaiku, Kawasaki 210, Japan.
fYear
1987
fDate
7-11 Sept. 1987
Firstpage
102
Lastpage
109
Abstract
This paper describes the recent progress of the microwave high-power devices in Japan, especially forcussing on GaAs power FETs. The fabrication process of power GaAs FET chips, and the internally matched power FETs covering from C- to Ka-band are described. New compound semiconductor devices such as InP MISFETs and HEMTs are also forcussed.
Keywords
Electromagnetic heating; Fabrication; Gallium arsenide; HEMTs; Indium phosphide; MOCVD; MODFETs; Microwave FETs; Microwave devices; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 1987. 17th European
Conference_Location
Rome, Italy
Type
conf
DOI
10.1109/EUMA.1987.333702
Filename
4132329
Link To Document