DocumentCode
1995516
Title
A New Method to Reduce the Side-Channel Leakage Caused by Unbalanced Capacitances of Differential Interconnections in Dual-Rail Logic Styles
Author
Quan, Jianping ; Bai, Guoqiang
Author_Institution
Inst. of Microelectron., Tsinghua Univ., Beijing
fYear
2009
fDate
27-29 April 2009
Firstpage
58
Lastpage
63
Abstract
Recently DPA resistant logic styles are of great concern. As far as we know, each kind of logic style has its own drawbacks. Masking logic styles can easily be attacked by the template attack. For dual-rail logic styles, TDPL can only keep the total power consumption of the whole cycle constant; as for WDDL, it becomes more and more difficult to efficiently match the interconnect capacitances of differential wires with shrinking feature sizes. To avoid these drawbacks, we present a new direction for routing effort to solve the unbalanced interconnection problem. By using three-phase logic and removing the load dependent power consumption in the evaluation phase and discharge phase, our logic style is insensitive to the unbalanced interconnect capacitances of differential wires. Additionally, the early propagation effect is another threat to certain DPA resistant logic styles. We also propose a theoretical method to solve it at the system level.
Keywords
capacitance; integrated circuit interconnections; integrated logic circuits; logic design; network routing; DPA resistant logic style; differential interconnection; differential power analysis; differential wires; dual-rail logic style; interconnect capacitances; power consumption; propagation effect; routing effort; side-channel leakage; three-phase dual-rail precharge logic; three-phase logic; unbalanced capacitance; Capacitance; Clocks; Energy consumption; Information technology; Logic; Microelectronics; Power measurement; Power system interconnection; Routing; Wires; NSDDL; TDPL; WDDL; early propagation effect; routing; unbalanced interconnections;
fLanguage
English
Publisher
ieee
Conference_Titel
Information Technology: New Generations, 2009. ITNG '09. Sixth International Conference on
Conference_Location
Las Vegas, NV
Print_ISBN
978-1-4244-3770-2
Electronic_ISBN
978-0-7695-3596-8
Type
conf
DOI
10.1109/ITNG.2009.185
Filename
5070593
Link To Document