Control of ultrasound direction with a miniaturized double-transducer for microwelding applications

Author

Mayer, Michael ; Hess, Peter

Author_Institution

Centre for Adv. Mater. Joining (CAMJ), Univ. of Waterloo, Waterloo, ON, Canada

fYear

2009

fDate

20-23 Sept. 2009

Firstpage

1

Lastpage

4

Abstract

Microelectronic Wire Bonding is an ultrasonic microwelding process enabling the economic production of today´s microchips by providing flexibel fine wire bond connections between integrated circuit and circuit board or substrate. To further accelerate and improve the quality of this process, a novel ultrasonic double-transducer system is reported with miniaturized dimensions. Based on a previously published design, finite elemente simulations are used to confirm the feasibility and demonstrate the function of the double-transducer numerically.

Keywords

finite element analysis; lead bonding; ultrasonic transducers; ultrasonic welding; fine wire bond connections; finite elemente simulations; microchip production; microelectronic wire bonding; microwelding applications; miniaturized double-transducer; ultrasonic double-transducer system; ultrasonic microwelding; ultrasound direction control; Acceleration; Bonding; Frequency; Joining materials; Production; Stress; Ultrasonic imaging; Ultrasonic transducers; Vibration control; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Ultrasonics Symposium (IUS), 2009 IEEE International

Conference_Location

Rome

ISSN

1948-5719

Print_ISBN

978-1-4244-4389-5

Electronic_ISBN

1948-5719

Type

conf

DOI

10.1109/ULTSYM.2009.5441614

Filename

5441614