Control of ultrasound direction with a miniaturized double-transducer for microwelding applications

Microelectronic Wire Bonding is an ultrasonic microwelding process enabling the economic production of today´s microchips by providing flexibel fine wire bond connections between integrated circuit and circuit board or substrate. To further accelerate and improve the quality of this process, a novel ultrasonic double-transducer system is reported with miniaturized dimensions. Based on a previously published design, finite elemente simulations are used to confirm the feasibility and demonstrate the function of the double-transducer numerically.