CAD tools for designing 3D integrated systems

Author

Siozios, K. ; Papanicolaou, A. ; Soudris, D.

Author_Institution

Sch. of Electr. & Comput. Eng., Nat. Tech. Univ. of Athens, Athens, Greece

fYear

2011

fDate

15-18 May 2011

Firstpage

2229

Lastpage

2232

Abstract

Expectations of consumer for future consumer electronics devices put significant strain on conventional design and manufacturing processes. Integrating more functionality in a smaller form factor with lower power consumption and cost is pushing traditional semiconductor technology scaling to its limits. Three dimensional chip stacking is touted as the silver bullet technology that can keep Moore´s momentum and fuel the next wave of consumer electronics products. This paper outlines a generic methodology to design 3D systems.

Keywords

circuit CAD; consumer electronics; integrated circuit design; three-dimensional integrated circuits; 3D integrated systems; 3D system design; CAD tools; Moore momentum; consumer electronics devices; consumer electronics products; manufacturing processes; power consumption; semiconductor technology; silver bullet technology; three dimensional chip stacking; Delay; Field programmable gate arrays; IP networks; Integrated circuit interconnections; Solid modeling; Three dimensional displays;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits and Systems (ISCAS), 2011 IEEE International Symposium on

Conference_Location

Rio de Janeiro

ISSN

0271-4302

Print_ISBN

978-1-4244-9473-6

Electronic_ISBN

0271-4302

Type

conf

DOI

10.1109/ISCAS.2011.5938044

Filename

5938044