DocumentCode :
1996457
Title :
High performance, ultra high voltage 4H-SiC IGBTs
Author :
Ryu, Sei-Hyung ; Capell, Craig ; Cheng, Lin ; Jonas, Charlotte ; Gupta, Anand ; Donofrio, Matt ; Clayton, Jack ; O´Loughlin, Michael ; Burk, Al ; Grider, David ; Agarwal, Anant ; Palmour, John ; Hefner, Allen ; Bhattacharya, Subhashish
Author_Institution :
Cree, Inc., Durham, NC, USA
fYear :
2012
fDate :
15-20 Sept. 2012
Firstpage :
3603
Lastpage :
3608
Abstract :
We present our latest developments in ultra high voltage 4H-SiC IGBTs. A 4H-SiC P-IGBT, with a chip size of 6.7 mm × 6.7 mm and an active area of 0.16 cm2 exhibited a record high blocking voltage of 15 kV, while showing a room temperature differential specific on-resistance of 24 mΩ-cm2 with a gate bias of -20 V. A 4H-SiC N-IGBT with the same area showed a blocking voltage of 12.5 kV, and demonstrated a room temperature differential specific on-resistance of 5.3 mΩ-cm2 with a gate bias of 20 V. Buffer layer design, which includes controlling the doping concentration and the thickness of the field-stop buffer layers, was used to control the charge injection from the backside. Effects on buffer layer design on static characteristics and switching behavior are reported.
Keywords :
buffer layers; charge injection; doping; insulated gate bipolar transistors; silicon compounds; switching circuits; 4H SiC N-IGBT; 4H SiC P-IGBT; SiC; buffer layer design; charge injection control; doping concentration control; size 6.7 mm; static characteristics; switching behavior; thickness control; voltage 12.5 kV; voltage 15 kV; voltage 20 V; Buffer layers; Doping; Insulated gate bipolar transistors; Integrated circuits; Logic gates; Temperature; Temperature measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Energy Conversion Congress and Exposition (ECCE), 2012 IEEE
Conference_Location :
Raleigh, NC
Print_ISBN :
978-1-4673-0802-1
Electronic_ISBN :
978-1-4673-0801-4
Type :
conf
DOI :
10.1109/ECCE.2012.6342311
Filename :
6342311
Link To Document :
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