• DocumentCode
    1998140
  • Title

    Monitoring of different complex materials with TSM resonators array

  • Author

    Caplain, Emmanuel ; Serfaty, Stéphane ; Griesmar, Pascal ; Martinez, Loïc ; Le Huerou, Jean-Yves

  • Author_Institution
    SATIE, Univ. de Cergy-Pontoise, Cergy-Pontoise, France
  • fYear
    2009
  • fDate
    20-23 Sept. 2009
  • Firstpage
    2504
  • Lastpage
    2507
  • Abstract
    To perform a spatial monitoring of complex fluids, a new sensors made of an array of Thickness Shear Mode Resonator (TSMR) is used. TSMR gives access to the spatial mechanical parameters such as the complex shear modulus. Using a network analyzer, the variation of the impedance of the TSMR around its resonance frequency can be measured. From this impedance measurement, previous works have shown that the complex shear modulus can accurately be extracted using an appropriate electrical model. To perform a spatial monitoring in inhomogeneous materials, a new sensor made of a TSMR array is proposed. This paper presents a new associated model of the TSMR array. Experimental study using water-glycerol mixtures confirm its validity. The efficiency of the rheological measurement using this type of sensor is also proved for gels formation monitoring.
  • Keywords
    acoustic impedance; acoustic resonators; liquid mixtures; network analysers; organic compounds; rheology; shear modulus; water; TSM resonators array; Thickness Shear Mode Resonator; complex fluids; complex materials; complex shear modulus; gels formation monitoring; impedance measurement; network analyzer; resonance frequency; rheological measurement; spatial monitoring; water-glycerol mixture; Biological materials; Impedance measurement; Mechanical sensors; Monitoring; Optical materials; Optical resonators; Resonant frequency; Sensor arrays; Silicon compounds; Viscosity; Thickness Shear Mode resonator array; complex fluids; complex shear modulus; component;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2009 IEEE International
  • Conference_Location
    Rome
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4244-4389-5
  • Electronic_ISBN
    1948-5719
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2009.5441717
  • Filename
    5441717