• DocumentCode
    1998215
  • Title

    Temperature and hump effect impact on output voltage spread of low power bandgap designed in the sub-threshold area

  • Author

    Joly, Y. ; Truphemus, L. ; Lopez, L. ; Portal, J.-M. ; Aziza, H. ; Mien, F. ; Fornara, P.

  • Author_Institution
    STMicroelectron., Rousset, France
  • fYear
    2011
  • fDate
    15-18 May 2011
  • Firstpage
    2549
  • Lastpage
    2552
  • Abstract
    Analog circuit designs are often biased to work in sub-threshold mode for low power constraints and for better gate-source voltage matching performances. Depending on process, hump effect may change MOS characteristics for negative Bulk-Source Voltage (VBS) and have a slight impact for VBS=0V. Actually, even without body effect, hump mainly degrades MOS matching performances in the sub-threshold area with significant temperature dependence. Thus, in order to accurately simulate bandgap performances, modeling of hump effect has to be considered.
  • Keywords
    MIS devices; analogue circuits; energy gap; low-power electronics; MOS characteristics; analog circuit designs; gate-source voltage matching; hump effect impact; low power bandgap; negative bulk-source voltage; output voltage spread; sub-threshold area mode; temperature dependence; voltage 0 V; Data models; Integrated circuit modeling; Logic gates; Photonic band gap; Silicon; Solid modeling; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (ISCAS), 2011 IEEE International Symposium on
  • Conference_Location
    Rio de Janeiro
  • ISSN
    0271-4302
  • Print_ISBN
    978-1-4244-9473-6
  • Electronic_ISBN
    0271-4302
  • Type

    conf

  • DOI
    10.1109/ISCAS.2011.5938124
  • Filename
    5938124