DocumentCode
1998655
Title
Capping Speculative Traces to Improve Performance in Simultaneous Multi-threading CPUs
Author
Yilin Zhang ; Wei-Ming Lin
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Texas at San Antonio, San Antonio, TX, USA
fYear
2013
fDate
20-24 May 2013
Firstpage
1555
Lastpage
1564
Abstract
Simultaneous Multi-Threading (SMT) improves the overall performance of superscalar CPUs by allowing concurrent execution of multiple independent threads with sharing of key data path components in order to better utilize the resources. Speculative executions help modern processors to exploit more Instruction-Level Parallelism. However, the performance penalty from a miss speculation is much more prominent in an SMT environment than a traditional multi-threading system due to the resulted waste of shared resources at clock-cycle level, versus thread level. In this paper, we show that instructions fetched due to incorrect prediction can be more than 30% of all instructions, which results in a huge waste of resources that could have been better used by other non-speculative threads. To minimize this waste of resources, a technique is proposed in this paper to control the amount of speculative instructions dispatched into Issue Queue (IQ), the most critically shared resource in the SMT pipeline. Simulation result shows the proposed technique can reduce the waste of resource due to miss-speculated traces by 38% and improve overall throughput by up to 17% in IPC.
Keywords
microprocessor chips; multi-threading; performance evaluation; IQ; SMT environment; SMT pipeline; capping speculative traces; clock cycle level; data path components; instruction level parallelism; issue queue; multithreading system; simultaneous multithreading CPU; Clocks; Instruction sets; Load modeling; Message systems; Pipelines; Throughput; Simultaneous Multi-Threading; Speculative Execution; Superscalar;
fLanguage
English
Publisher
ieee
Conference_Titel
Parallel and Distributed Processing Symposium Workshops & PhD Forum (IPDPSW), 2013 IEEE 27th International
Conference_Location
Cambridge, MA
Print_ISBN
978-0-7695-4979-8
Type
conf
DOI
10.1109/IPDPSW.2013.27
Filename
6651052
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