Title :
Electrodeposition of hydroxyapatite (HAp) coatings on etched titanium mesh substrate
Author :
Isa, N.N.C. ; Mohd, Yusairie ; Yury, N.
Author_Institution :
Fac. of Appl. Sci., Univ. Teknol. MARA, Shah Alam, Malaysia
Abstract :
This study was carried out in order to investigate the formation of hydroxyapatite (HAp) coatings on etched Ti mesh substrate using electrodeposition technique. The coatings were deposited from solution containing CaCl2 and NH4H2PO4 (with Ca/P ratio being 1.67) by maintaining cathodic potentials for - 0.8 V and - 1.5 V vs Ag/AgCl for 30 min at 80 °C. On the other hand, chitosan solution was also added into bath solution to study its effect on coatings morphology. The surface morphology and the elemental compositions of the Ti surface before and after deposition were observed by FESEM and EDAX, respectively. Etching process has changed the morphology of the Ti surface from smooth to rough surface. HAp coatings deposited at - 0.8 V and - 1.5 V have similar morphology with flower-like structure. However, the coatings are more dense and compact when deposited at higher potential (i.e.: - 1.5 V). When chitosan was added into bath solution, the morphological structure of the coating was significantly changed from flower-like structure to flake-like structure interconnected with net-like structure of chitosan.
Keywords :
X-ray chemical analysis; bioceramics; calcium compounds; electrodeposition; etching; field emission electron microscopy; scanning electron microscopy; surface morphology; surface roughness; Ca10(PO4)6(OH)2; EDAX; FESEM; Ti; bath solution; cathodic potentials; chitosan solution; coatings morphology effect; electrodeposition; etching; flake-like structure; flower-like structure; hydroxyapatite coatings; morphological structure; net-like structure; smooth surface; surface roughness; temperature 80 degC; time 30 min; titanium mesh substrate; voltage -1.5 V; voltage 0.8 V; chitosan; coatings; electrodeposition; hydroxyapatite; titanium mesh;
Conference_Titel :
Humanities, Science and Engineering (CHUSER), 2012 IEEE Colloquium on
Conference_Location :
Kota Kinabalu
Print_ISBN :
978-1-4673-4615-3
DOI :
10.1109/CHUSER.2012.6504417