30 watt surface-mount power amplifiers for PCS and UMTS applications

Author

Crescenzi, E. James, Jr. ; Griswold, Bradley ; Mohammed, Anwar ; Buss, Robert ; Pengelly, Raymond

Author_Institution

Cree Microwave Corp., Sun Valley, CA, USA

fYear

2003

fDate

10-13 Aug. 2003

Firstpage

393

Lastpage

396

Abstract

Small surface-mount power amplifiers have been developed that produce 30 watts of peak power in the PCS and UMTS frequency bands. These two-stage amplifiers exhibit typical gain of 28 dB with good linearity and efficiency under CDMA signal protocols. The designs involve a combination of chip-and-wire plus SMT lumped and distributed matching elements on a thick-film substrate. The thermal design includes two levels of heat spreading through metal base elements before the PCB attachment interface. FET maximum channel temperatures for PCB mounted devices are typically 121 °C for 5 W average CDMA output with a +85 °C base temperature. The 30 W peak power is believed to be the highest reported for a commercial surface-mount amplifier operating in a microwave band.

Keywords

3G mobile communication; UHF power amplifiers; code division multiple access; field effect transistors; personal communication networks; surface mount technology; 121 degC; 28 dB; 30 W; 5 W; 85 degC; CDMA signal protocols; FET; PCB attachment interface; PCB mounted devices; SMT lumped; UMTS applications; Universal Mobile Telecommunication System; code division multiple access; distributed matching elements; frequency bands; maximum channel temperatures; microwave band; surface-mount power amplifiers; thick-film substrate; 3G mobile communication; Frequency; Gain; Linearity; Multiaccess communication; Personal communication networks; Power amplifiers; Protocols; Surface-mount technology; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio and Wireless Conference, 2003. RAWCON '03. Proceedings

Print_ISBN

0-7803-7829-6

Type

conf

DOI

10.1109/RAWCON.2003.1227975

Filename

1227975