Title :
Dual-mode intracranial catheters for minimally-invasive neuro-oncology feasibility study
Author :
Herickhoff, Carl D. ; Light, Edward D. ; Wolf, Patrick D. ; Smith, Stephen W. ; Grant, Gerald A. ; Britz, Gavin W.
Author_Institution :
Dept. of Biomed. Eng., Duke Univ., Durham, NC, USA
Abstract :
In this study, we investigated the feasibility of dual-mode intracranial catheter transducers for visualization and treatment of tumors in the brain. Feasibility is demonstrated in two ways: 1) by developing a 12 Fr, integrated matrix and linear array catheter transducer prototype for combined real-time 3D imaging and heating, and 2) by testing 3.5 Fr IVUS-catheter-packageable transducers for therapeutic potential. The 3.6 MHz, 12 Fr catheter acquired real-time 3D images of canine brain structures in vivo while placed in the superior sagittal sinus via a burr hole in the skull, and achieved a 3.5°C temperature rise in tissue-mimicking material at a 2 cm focus in vitro. The IVUS-sized prototype transducers were tested for maximum intensity and mechanical index, and a thermal model was used to extrapolate and estimate each transducer´s maximum potential temperature rise in brain tissue.
Keywords :
biomedical transducers; biomedical ultrasonics; biothermics; catheters; heating; neurophysiology; radiation therapy; tumours; IVUS-catheter-packageable transducers; brain tissue; burr hole; canine brain structure in vivo; dual-mode intracranial catheter transducers; dual-mode intracranial catheters; heating; intravascular ultrasound imaging; linear array catheter transducer prototype; minimally-invasive neuro-oncology; patient treatment; real-time 3D imaging; skull; superior sagittal sinus; temperature 3.5 degC; therapeutic potential; thermal model; tissue-mimicking material; tumours; Brain; Catheters; Heating; In vivo; Neoplasms; Prototypes; Temperature; Testing; Transducers; Visualization; dual-mode catheter transducer; intravascular ultrasound; ultrasound hyperthermia;
Conference_Titel :
Ultrasonics Symposium (IUS), 2009 IEEE International
Conference_Location :
Rome
Print_ISBN :
978-1-4244-4389-5
Electronic_ISBN :
1948-5719
DOI :
10.1109/ULTSYM.2009.5441798