Title :
SET and SEU Analyses Based on Experiments and Multi-Physics Modeling Applied to the ATMEL CMOS Library in 180 and 90-nm Technological Nodes
Author :
Hubert, Guillaume ; Truyen, D. ; Artola, L. ; Briet, M. ; Heng, C. ; Lakys, Y. ; Leduc, E.
Author_Institution :
French Aerosp. Lab. (ONERA), Toulouse, France
Abstract :
This work describes test structures and modeling which have been applied to characterize SET pulse widths of standard ATMEL CMOS libraries in 180 and 90-nm technologies. The modeling methodology from physical-level to electrical-level induced SEU/MBU and SET, is also presented. The methodology includes the GDS extractor, the physical (carrier generation, transport and charge collection) and the circuit levels. The devices and test vehicles characterized in this work range from inverter to fully functional SRAMs integrating standard and hardened circuits. Then, this work analyses SET measured on test structures including circuits designed and fabricated in 180-nm and 90-nm processes. Results obtained for a 180-nm SRAM cell and a DFF are consistent. For the 90-nm cells, results obtained are less satisfactory. Nevertheless, the comparisons between the experiment and the calculation about the impact induced by the drive strength or the load configuration are consistent. Results issued from complex cell (i.e. customized DFF) show that modeling is relevant for designing efficient hardening cells for aerospace applications. Indeed, the SET or SEU sensitivity maps, the cross sections, and the SET distributions give precious information to the radiation expert designer about the efficiency and reliability of the chosen hardened techniques.
Keywords :
CMOS digital integrated circuits; SRAM chips; flip-flops; integrated circuit design; integrated circuit modelling; radiation hardening (electronics); ATMEL CMOS library; DFF; GDS extractor; MBU; SET analysis; SET distributions; SET pulse widths; SEU analysis; SEU sensitivity maps; SRAM cell; carrier generation; charge collection; delay flip-flop; general design specification; multiphysics modeling; radiation expert designer; single event transient; single event upset; size 180 nm; size 90 nm; CMOS integrated circuits; Integrated circuit modeling; Radiation hardening (electronics); Semiconductor device modeling; Sensitivity; Single event transients; Single event upsets; Hardening by design; MUSCA SEP3; SEE modeling; SET cross section; SET or SEU sensitivity maps; single event transient (SET); single event upset (SEU);
Journal_Title :
Nuclear Science, IEEE Transactions on
DOI :
10.1109/TNS.2014.2363764