DocumentCode
2001991
Title
MiMAC - A New Multilayer Thin Film Microwave Component Technology
Author
Redfern, S.W.
Author_Institution
Marconi Electronic Devices Limited, Doddington Road, Lincoln LN6.3LF
fYear
1988
fDate
12-15 Sept. 1988
Firstpage
1034
Lastpage
1040
Abstract
A new integrated thin film process is described which permits the inclusion of passive circuit elements at the substrate fabrication stage. Microwave Monolithic Alumina Circuits (MiMAC) offer cost and performance advantages over conventional chip and wire hybrids. Details of this process are presented, together with results for a MiMAC amplifier design which shows improved performance over it´s conventional hybrid equivalent.
Keywords
Costs; Fabrication; Integrated circuit technology; Microwave circuits; Microwave technology; Nonhomogeneous media; Passive circuits; Substrates; Thin film circuits; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 1988. 18th European
Conference_Location
Stockholm, Sweden
Type
conf
DOI
10.1109/EUMA.1988.333946
Filename
4132634
Link To Document