Title :
Acoustic microscopy — Beyond high resolution imaging
Author :
Saijo, Yoshifumi
Author_Institution :
Grad. Sch. of Biomed. Eng., Tohoku Univ. Sendai, Sendai, Japan
Abstract :
There are three major objectives of acoustic microscopy in medicine and biology; 1) rapid examination of histopathology without staining or slicing, 2) search for the origin of echo in clinical ultrasound imaging and 3) novel approach to the pathophysiology from biomechanical point of view. The design of our newest acoustic microscopy is flexible to realize multimode ultrasound microscope with conventional C-mode, surface impedance mode, B-mode and reconstructed 3D mode. Measurements of microscopic acoustic properties in gastric cancer, renal cancer, myocardial infarction, atherosclerosis, tendon, cartilage and brain have provided useful information not limited in the field of medical ultrasound but also in the field of biomechanics especially in cardiology and orthopedic surgery. Passions of biomedical researchers to find the new horizons in pathophysiology are important for future progression of acoustic microscopy.
Keywords :
acoustic microscopy; bioacoustics; biological organs; biological techniques; biological tissues; biomechanics; biomedical ultrasonics; cancer; cardiology; orthopaedics; ultrasonic imaging; B-mode operation; C-mode operation; acoustic microscopy; atherosclerosis; biology; biomechanics; brain; cardiology; cartilage; clinical ultrasound imaging; echo; gastric cancer; histopathology; medicine; microscopic acoustic properties; multimode ultrasound microscope; myocardial infarction; orthopedic surgery; pathophysiology; reconstructed 3D mode operation; renal cancer; surface impedance mode operation; tendon; Acoustic imaging; Biomedical acoustics; Biomedical imaging; Cancer; High-resolution imaging; Image reconstruction; Microscopy; Surface impedance; Surface reconstruction; Ultrasonic imaging; acoustic impedance; acoustic microscopy; attenuation; biomechanics; sound speed;
Conference_Titel :
Ultrasonics Symposium (IUS), 2009 IEEE International
Conference_Location :
Rome
Print_ISBN :
978-1-4244-4389-5
Electronic_ISBN :
1948-5719
DOI :
10.1109/ULTSYM.2009.5441892