Detection of electrochemical migration growth along the thickness direction in a paper/phenol-resin composite

In order to study the growth of electrochemical migration along the thickness direction, paper/phenol-resin composite on printed wiring boards was aged at 85 °C and 85 %RH by applying of a dc voltage. Then, the sample was observed by a scanning electron microscope with a function of energy dispersive spectroscopy (SEM-EDS) analysis. Space charge distributions in the sample were also measured by the pulsed electroacoustic method. Signals of SEM-EDS showing the presence of Cu were observed on both the anode and cathode. This fact indicates that ionized copper moves toward the cathode inside the composite when an electric field is applied at high temperatures in a highly humid atmosphere.