• DocumentCode
    2002746
  • Title

    High electromechanical coupling coefficient SAW resonator on Ta2O5/Al/LinbO3 structure for wide duplex gap application

  • Author

    Nakanishi, H. ; Nakamura, H. ; Goto, R.

  • Author_Institution
    Corp. Components Dev. Center, Panasonic Electron. Devices Co., Ltd., Osaka, Japan
  • fYear
    2009
  • fDate
    20-23 Sept. 2009
  • Firstpage
    2639
  • Lastpage
    2642
  • Abstract
    This paper describes the development of high electromechanical coupling coefficient (K2) SAW resonator on a Ta2O5/Al/LiNbO3 structure for wide duplex gap application. We have cleared that the optimum Ta2O5 thickness which the high performance SAW resonator without Rayleigh-mode spurious response could be realized. Also, the Ta2O5 film has an advantage of decreasing the film thickness compared with SiO2 film. The developed SAW resonator shows the excellent performances which are low insertion loss, high attenuation, and high K2 of 23%. So, we have exhibited the possibility of Ta2O5/Al/5°YX-LiNbO3 structure for wide duplex gap application as the alternatives to the SiO2/Al/5°YX-LiNbO3 structure. And, the SAW resonator has the possibility to apply to Band IV duplexer.
  • Keywords
    acoustic wave absorption; aluminium; lithium compounds; surface acoustic wave resonators; tantalum compounds; Band IV duplexer; Rayleigh mode spurious response; SAW resonator; Ta2O5-Al-LiNbO3; attenuation; electromechanical coupling coefficient; film thickness; insertion loss; wide duplex gap application; 3G mobile communication; Attenuation; Electrodes; Insertion loss; Performance loss; Resonance; Resonant frequency; Shape control; Substrates; Surface acoustic waves; Rayleigh-mode spurious response; SAW resonator; Ta2O5/Al/LiNbO3 structure; high electromechanical coupling coefficient;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2009 IEEE International
  • Conference_Location
    Rome
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4244-4389-5
  • Electronic_ISBN
    1948-5719
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2009.5441913
  • Filename
    5441913