DocumentCode :
2004084
Title :
Dielectric frequency response of epoxy-based composites with various silica filler sizes
Author :
Morshuis, P.H.F. ; Andritsch, T. ; Kochetov, R. ; Fréchette, M.F. ; Martinez, H.D. ; Savoie, S. ; Krivda, A. ; Smith, L.E. ; Zegarac, D.
Author_Institution :
Delft Univ. of Technol., Delft, Netherlands
fYear :
2010
fDate :
4-9 July 2010
Firstpage :
1
Lastpage :
4
Abstract :
Various epoxy-based samples were prepared with different content of micro- and nanosized silica filer. In the case of a constant %-weight content of filler amounting to 65%, the microphase was replaced by a nanophase consisting of 2.5% and 5% weight. Three research teams used dielectric spectroscopy to compare the dielectric behaviour of the different composites. Microstructure analyses of the various epoxy-based compounds using TEM indicated that there was little variance in the homogeneity. The influence of post heat treatment under vacuum was assessed. After post-treatment, all sets of data show similar trends.
Keywords :
dielectric materials; heat treatment; nanocomposites; nanofabrication; permittivity; resins; silicon compounds; transmission electron microscopy; TEM; dielectric frequency response; dielectric spectroscopy; epoxy-based composites; homogeneity variance; microsized silica filer; microstructure analyses; nanosized silica filer; post heat treatment; silica filler sizes; Dielectrics; Heat treatment; Nanocomposites; Nanoparticles; Permittivity; Plastics; Silicon compounds; dielectric spectroscopy; epoxy resin; heat treatment; nanocomposites; silica;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid Dielectrics (ICSD), 2010 10th IEEE International Conference on
Conference_Location :
Potsdam
Print_ISBN :
978-1-4244-7945-0
Electronic_ISBN :
978-1-4244-7943-6
Type :
conf
DOI :
10.1109/ICSD.2010.5568094
Filename :
5568094
Link To Document :
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