• DocumentCode
    2004233
  • Title

    Nano-and micro-silica modification of epoxy polymers

  • Author

    Rouyre, T. ; Taylor, A.C. ; Fu, M. ; Perrot, F. ; James, I.

  • Author_Institution
    Dept. of Mech. Eng., Imperial Coll. London, London, UK
  • fYear
    2010
  • fDate
    4-9 July 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Epoxy polymers reinforced with a premixed epoxy/nano-silica masterbatch or dry non-surface-treated nano-silica and ground micro-silica flour were compared. Cured plates of epoxy containing both nano-particles (up to 15 %wt) and micro-particles (up to 51 %wt) of silica were produced and tested. The glass transition temperature, Tg, of the epoxy was measured using differential scanning calorimetry (DSC), and no significant changes were observed. Scanning electron microscopy (SEM) observations, combined with energy-dispersive X-ray (EDX) analysis were performed to assess the particles dispersion and the chemical content of the microstructure. The tensile modulus was always found to increase due to the addition of silica. Experimental data was compared to theoretical predictions, including the Halpin-Tsai and Lewis-Nielsen models, and a reasonable agreement was obtained. The dielectric properties of the nano- and micro-particle composites were characterised by a series of electrical tests. Influences on dielectric permittivity, resistivity and dielectric loss were found, depending on the type of filler. High values of dielectric strength were measured. An improvement due to the micro-particles was found, while nano-silica had a slight negative effect. Premixed fillers were found to show a better dispersion in comparison with dry powder, with a direct consequence on dielectric permittivity and dielectric loss.
  • Keywords
    X-ray chemical analysis; curing; dielectric losses; differential scanning calorimetry; electric strength; electrical resistivity; filled polymers; glass transition; nanocomposites; nanoparticles; permittivity; resins; scanning electron microscopy; silicon compounds; tensile strength; DSC; EDX; Halpin-Tsai models; Lewis-Nielsen models; SEM; SiO2; cured plates; dielectric loss; dielectric permittivity; dielectric properties; dielectric strength; differential scanning calorimetry; dry nonsurface-treated nanosilica; electrical tests; energy-dispersive X-ray analysis; epoxy polymers; epoxy-nanosilica masterbatch; glass transition temperature; ground microsilica flour; microparticle composites; microsilica modification; microstructure; nanoparticle composites; nanosilica modification; particle dispersion; resisitivity; scanning electron microscopy; tensile modulus; Dielectrics; Dispersion; Permittivity; Plastics; Powders; Silicon compounds; Temperature measurement; Epoxy; dielectric loss; elastic modulus; electrical breakdown; microsilica; nanocomposites; nanosilica; permittivity; resistivity; toughness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid Dielectrics (ICSD), 2010 10th IEEE International Conference on
  • Conference_Location
    Potsdam
  • Print_ISBN
    978-1-4244-7945-0
  • Electronic_ISBN
    978-1-4244-7943-6
  • Type

    conf

  • DOI
    10.1109/ICSD.2010.5568103
  • Filename
    5568103