DocumentCode
2004291
Title
Mechanisms for single-particle latchup in CMOS structures
Author
Johnston, A.H.
Author_Institution
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
fYear
1993
fDate
13-16 Sep 1993
Firstpage
433
Lastpage
437
Abstract
Mechanisms for single-particle latchup are investigated for several different CMOS processes, placing particular emphasis on factors that affect latchup triggering. The results show that the spacing between the well and substrate is less important than the geometry of well contacts in determining latchup susceptibility. Substrate characteristics also play an important role. A bulk p-well process was found to be far more resistant to latchup than a comparable bulk n-well process because of lower charge collection efficiency and higher doping concentration in the p-well
Keywords
CMOS integrated circuits; doping profiles; electrical faults; ion beam effects; radiation hardening (electronics); semiconductor device models; CMOS structures; bulk n-well process; bulk p-well process; charge collection efficiency; doping concentration; latchup susceptibility; latchup triggering; single-particle latchup; substrate characteristics; well contact geometry; CMOS process; CMOS technology; Circuit testing; Doping; Geometry; Laboratories; Propulsion; Pulse measurements; Semiconductor device modeling; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Radiation and its Effects on Components and Systems, 1993.,RADECS 93., Second European Conference on
Conference_Location
St. Malo
Print_ISBN
0-7803-1793-9
Type
conf
DOI
10.1109/RADECS.1993.316564
Filename
316564
Link To Document