• DocumentCode
    2004291
  • Title

    Mechanisms for single-particle latchup in CMOS structures

  • Author

    Johnston, A.H.

  • Author_Institution
    Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
  • fYear
    1993
  • fDate
    13-16 Sep 1993
  • Firstpage
    433
  • Lastpage
    437
  • Abstract
    Mechanisms for single-particle latchup are investigated for several different CMOS processes, placing particular emphasis on factors that affect latchup triggering. The results show that the spacing between the well and substrate is less important than the geometry of well contacts in determining latchup susceptibility. Substrate characteristics also play an important role. A bulk p-well process was found to be far more resistant to latchup than a comparable bulk n-well process because of lower charge collection efficiency and higher doping concentration in the p-well
  • Keywords
    CMOS integrated circuits; doping profiles; electrical faults; ion beam effects; radiation hardening (electronics); semiconductor device models; CMOS structures; bulk n-well process; bulk p-well process; charge collection efficiency; doping concentration; latchup susceptibility; latchup triggering; single-particle latchup; substrate characteristics; well contact geometry; CMOS process; CMOS technology; Circuit testing; Doping; Geometry; Laboratories; Propulsion; Pulse measurements; Semiconductor device modeling; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radiation and its Effects on Components and Systems, 1993.,RADECS 93., Second European Conference on
  • Conference_Location
    St. Malo
  • Print_ISBN
    0-7803-1793-9
  • Type

    conf

  • DOI
    10.1109/RADECS.1993.316564
  • Filename
    316564