• DocumentCode
    2004505
  • Title

    Development of high frequency annular array ultrasound transducers using interdigital bonded composites

  • Author

    Chabok, Hamid Reza ; Cannata, Jonathan Matthew ; Kim, Hyung Ham ; Shung, K. Kirk

  • Author_Institution
    Biomed. Eng. Dept., Univ. of Southern California, Los Angeles, CA, USA
  • fYear
    2009
  • fDate
    20-23 Sept. 2009
  • Firstpage
    2708
  • Lastpage
    2711
  • Abstract
    The design, fabrication, and testing of 1-3 composite annular array transducers is presented. An interdigital bonded (IB) 1-3 composite was manufactured using two IB operations on a fine-grain piezoelectric ceramic. Unloaded epoxy was used for both the matching and backing layers and a flexible circuit was used for interconnect. The final composite had 19 ¿m wide posts separated by 6¿m wide polymer kerfs. One array was tested and the results were found to be in good agreement with KLM modeled results. The average measured pulse-echo response for array elements was 34.3 MHz with 57.5 % -6 dB bandwidth. The maximum crosstalk between neighbor elements was -38.5 dB. A novel fabrication step greatly simplified fabrication process by eliminating the need for electrode patterning and alignment of that pattern between the composite and flex circuit.
  • Keywords
    composite materials; crosstalk; integrated circuit interconnections; interdigital transducers; piezoceramics; ultrasonic transducers; array elements; crosstalk; electrode patterning; fine-grain piezoelectric ceramic; flexible circuit; high frequency annular array ultrasound transducers; interconnect; interdigital bonded composites; pattern alignment; pulse-echo response; transducer design; transducer fabrication; transducer testing; unloaded epoxy; Bonding; Circuit testing; Fabrication; Frequency; Manufacturing; Piezoelectric transducers; Pulse measurements; Ultrasonic imaging; Ultrasonic transducer arrays; Ultrasonic transducers; annular array; composite; high frequency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2009 IEEE International
  • Conference_Location
    Rome
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4244-4389-5
  • Electronic_ISBN
    1948-5719
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2009.5441999
  • Filename
    5441999