• DocumentCode
    2004689
  • Title

    1–3 piezocomposite design optimised for high frequency kerfless transducer arrays

  • Author

    Démoré, C. E M ; Cochran, S. ; Garcia-Gancedo, L. ; Dauchy, F. ; Button, T.W. ; Bamber, J.C.

  • Author_Institution
    Inst. for Med. Sci. & Technol., Univ. of Dundee, Dundee, UK
  • fYear
    2009
  • fDate
    20-23 Sept. 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Piezocomposites that can operate at frequencies above 30 MHz without spurious modes are required in order to develop sufficiently sensitive high frequency arrays for high resolution imaging. However, scaling down of conventional piezocomposite fabrication techniques becomes increasingly difficult as dimensions decrease with increasing frequency. The approach presented here is to use micro-moulded 1-3 piezocomposites and a distribution of piezoelectric segment size and separation. Innovative approaches to composite pattern design, based on a randomized spatial distribution, are presented. Micro-moulding techniques are shown to be suitable for fabricating composites with dimensions required for high frequency composites. Randomized piezocomposite patterns are modeled and are shown to suppress spurious modes.
  • Keywords
    composite materials; microfabrication; micromechanical devices; moulding; piezoceramics; piezoelectric transducers; ultrasonic imaging; ultrasonic transducer arrays; composite pattern design; high frequency arrays; high frequency kerfless transducer arrays; high resolution imaging; micromoulded piezocomposites; micromoulding techniques; optimised piezocomposite design; piezocomposite fabrication down scaling; piezoelectric segment separation; piezoelectric segment size; randomized spatial distribution; spurious mode suppression; Acoustic transducers; Biomedical imaging; Biomedical transducers; Ceramics; Design optimization; Electrodes; Fabrication; Frequency; Optical arrays; Shape; 1–3 composite; high-frequency array; micromoulding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2009 IEEE International
  • Conference_Location
    Rome
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4244-4389-5
  • Electronic_ISBN
    1948-5719
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2009.5442007
  • Filename
    5442007