Design of BGA assembly for PHM implementation in vibration environment

Application of electronic devices in automotive industry keeps increasing and adoption of BGA assembly is inevitable in the industry. Vibrating environment in a vehicle provides another hazardous stress to the BGA assembly in addition to thermal one. In this study, random vibration tests on a daisy-chained BGA assembly have been conducted with real-time monitoring of resistance. The change of resistance before the occurrence of failure has been investigated and a precursory resistance change before the failure of BGA assemblies has been proposed. Analyses on the failure location have confirmed the localized failure pattern on the BGA matrix. Based on the studies, a noble design of BGA assemblies has been suggested for the implementation of prognostics and health monitoring in vibration environment.