Thermoelectric cooling of high power extremely localized heat sources: system aspects

Author

Semenyuk, V. ; Stockholm, J.G. ; Gerard, F.

Author_Institution

Thermion Co., Odessa State Acad. of Refrigeration, Ukraine

fYear

1999

fDate

Aug. 29 1999-Sept. 2 1999

Firstpage

40

Lastpage

44

Abstract

A generalized approach to the cooling of localized high power heat sources is given. A system is considered, which consists of a heat source and a cooling unit including a cascade thermoelectric cooler (TEC) and a finned heat exchanger with a fan. The method of optimal integration of a TEC into the cooling system, which provides minimal input power is described. The cooling unit destined to maintain a concentrated (0.8/spl times/2.5 mm) 8 W heat source at 25/spl deg/C, the ambient temperature being of 70/spl deg/C, is fabricated and tested.

Keywords

cooling; heat sinks; optimisation; semiconductor device packaging; thermal analysis; thermal management (packaging); thermal resistance; thermoelectric devices; 25 C; 70 C; 8 W; cascade thermoelectric cooler; cooling system; extremely localized heat sources; fan; finned heat exchanger; high power heat sources; high power laser diode; thermoelectric cooling; Electronics cooling; Heat sinks; Heat transfer; Leg; Resistance heating; Space heating; Tellurium; Temperature; Thermal resistance; Thermoelectricity;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermoelectrics, 1999. Eighteenth International Conference on

Conference_Location

Baltimore, MD, USA

ISSN

1094-2734

Print_ISBN

0-7803-5451-6

Type

conf

DOI

10.1109/ICT.1999.843330

Filename

843330