• DocumentCode
    2006315
  • Title

    Propagation of electrical tree growth in a composite solid insulation consisted of epoxy resin and mica sheets: Simulation with the aid of Cellular Automata

  • Author

    Christantoni, D.D. ; Vardakis, G.E. ; Danikas, M.G.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Democritus Univ. of Thrace, Xanthi, Greece
  • fYear
    2010
  • fDate
    4-9 July 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Electrical treeing is one of the principal factors affecting the insulating capability of solid insulation. Epoxy resin with mica sheets is used in machine insulation. In the present paper, a point-plane electrode arrangement was used in order to simulate the electrical tree propagation in such an insulating system. The mica sheets investigated were of comparable thickness with the epoxy resin. The simulation was performed with the aid of Cellular Automata (CA). Laplace equation has been solved setting appropriate boundary conditions at the interfaces between epoxy resin - mica sheet and epoxy resin - electrodes. The simulations were based on the local field variation, the local dielectric strength and also on the variation (even slight) of the dielectric constant of the insulating materials. Such local variations of the dielectric constants render possible local variations of the electrical field and, consequently, of the tree propagation. Mica sheets as barriers inside the main insulating material preventing the electrical tree growth. The thickness of mica sheets plays an important role in the propagation of trees. The simulations indicate that even in the case of a partial penetration of the mica sheets, no complete breakdown results. The applied voltage level plays also a crucial role in the resulting type of electrical tree. Higher applied voltages result in a bush-type tree, whereas lower applied voltages result in more pointed trees. The simulation results agree with experimental data.
  • Keywords
    Laplace equations; cellular automata; composite insulating materials; epoxy insulation; mica; permittivity; resins; trees (electrical); Laplace equation; cellular automata; composite solid insulation; dielectric constant; electrical tree growth; electrical treeing; epoxy resin; mica sheet; point plane electrode arrangement; Automata; Dielectric breakdown; Dielectrics; Electrodes; Epoxy resins; Solids;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid Dielectrics (ICSD), 2010 10th IEEE International Conference on
  • Conference_Location
    Potsdam
  • Print_ISBN
    978-1-4244-7945-0
  • Electronic_ISBN
    978-1-4244-7943-6
  • Type

    conf

  • DOI
    10.1109/ICSD.2010.5568239
  • Filename
    5568239